MPi Ospray Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is broadly used on gold bump and pad wafer testing for Show driver, logic, and memory product. MPI’s cantilever probes will be the corresponding remedy to the demands of fi­ne pitch, tiny pad measurement, superior velocity, significantly less cleaning, multi-DUT, substantial pin rely, and extremely-very low leakage prerequisites. With outstanding craftsmanship, progressive architecture and established methodologies determined by mechanical and electrical simulation/measurement effects, earning MPI the best cantilever company around the globe.


FCB Probe Card

The FCB Probe Card is easily the most experienced know-how of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB is actually a confirmed Answer for a variety of semiconductor production checks from early engineering pilot-runs to higher quantity producing (HVM). FCB is ready for gadget demanding significant signal integrity probing (SI) and/or energy integrity probing (PI). Purposes incorporate reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the globe’s greatest overall Charge-of-possession (COO) for several DUT programs.


EVS Probe Card

The EVS Probe Card is an improvement more than the standard buckling beam probe card. Crucial features are increased present carrying potential (C.C.C.) and reduced well balanced Make contact with drive (BCF), along with In general MEMS-like attributes. EVS can certainly satisfy the need of Superior wafer probing. Specific alignment and superb planarity Regulate would be the critical elements contributing to steady contact resistance. With its capability click here and general performance, EVS Probe Card is a perfect option for Highly developed probe cards.


Osprey probe card

The Osprey probe card is MPI’s Remedy to desire for at any time finer pitch. It is made for scaled-down Al pad, and is particularly ideal for small pitch application with peripheral and whole array sample. With specific alignment and better planarity Handle, Osprey can get to bigger efficiency by multi-DUT style.  The forming wire (FW) sort needle developed with MPI’s have micro fabrication process not only delivers higher-top quality effectiveness and also will allow easy needle replacement and shortens sustaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of small drive probing. In addition it comes along with the opportunity to satisfy large C.C.C. and large pin counts application. The MEMS procedure ensures highly dependable needle properties, plus the Exclusive construction design and style enables specific alignment and planarity Management.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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